Info

AOI Automatic optical inspection Backpanels Blind mircovias Buried mikrovias CEM-1 CEM-3 Controlled impedance Double-sided PCBs Edge connectors Electroless nickel and immersion gold ENIG Entek Flex/rigid PCBs Flexible circuits FR-4 HASL HDI PCBs High definition interconnects Hot-airlevelling Immersion silver Immersion tin IMS Insulated metal structures Ion contamination Laser direct imaging LDI Lead-free hot-air leveling LF HAL Metal-based PCBs Microvia holes Microvia Organic solderability preservatives Organic solderability protection OSP PCB build-up 1+N+1 PCB build-up 2+N+2 PCB build-up 3+N+3 PCBs PCBs with heavy copper PCBs with silver-filled holes Peelable solder masks Perfag PFC Plated through holes Plated-through holes PLT Preben Lund Technology Printed circuits Printed flexible circuits Printed wiring boards PTH PWB RCC boards RoHS SBU Sequential build-up Single-sided PCBs Solder masks Stacked microvias Staggered microvias Teflon boards Track width/spacing Via holes